Solid Source ECR Plasma Deposition Device "AFTEX-9000 Series"
Low-temperature process, high refractive index control, high-speed reactive film formation, dense and flat film.
The "AFTEX-9000 series" is a device capable of achieving high-quality nano thin film formation at low temperatures and with low damage. It supports substrate sizes of up to 8 inches and can accommodate up to three ECR plasma sources, significantly improving productivity by operating them simultaneously. Please use our equipment for nano thin film formation. 【Features】 ■ A fully automated C to C single wafer system with a multi-chamber design that can connect up to three ECR deposition modules for 8-inch substrates. ■ Achieves high productivity with simultaneous deposition using three ECR plasmas. ■ Allows for the setting of transport flow, deposition chamber, and deposition process through recipes, enabling fully automated deposition of multilayer films with any material. ■ Excellent uniformity is achieved through substrate tilt rotation and low-pressure deposition. ■ An in-device spectroscopic system (optional) enables measurement of film thickness, refractive index dispersion, etc. ■ Directly reacts raw material particles from solid sources with a highly active ECR plasma flow, eliminating the need for expensive exhaust treatment equipment and being environmentally friendly. *For more details, please refer to the catalog or feel free to contact us.
- Company：JSWアフティ
- Price：Other
